Wikipedia / Tolapai
Wikipedia / Tolapai
Tolapai is the code name of Intel's embedded system on a chip (SoC) which combines a Pentium M (Dothan) processor core, DDR2 memory controllers and input/output (I/O) controllers, and a QuickAssist integrated accelerator unit for security functions.
Overview
The Tolapai embedded processor has 148 million transistors on a 90 nm process technology, 1088-ball FCBGA with a 1.092mm pitch, and comes in a 37.5mm × 37.5mm package. It is also Intel's first integrated x86 processor, chipset and memory controller since 1994's 80386EX.
Intel EP80579 integrated processor for embedded computing:
CPU: Pentium M clocked from between 600MHz and 1.2GHz
Cache: 256 KB
Package: 1088-ball flip chip BGA
Memory: DDR2 from 400- to 800MHz; MCH supports DIMM or memory down with optional 32-/64-bit and ECC configurations
Bus: One local expansion bus for general control or expanded peripheral connections
PCI Express: PCIe root complex interface in 1 ×8, 2 ×4, or 2 ×1 configurations
Storage: 2× SATA (Gen1 or Gen2) interfaces
Networking: 3× 10/100/1000 Ethernet MACs supporting reduced gigabit media-independent interface (RGMII) or reduced media-independent interface (RMII), and Management Data Input/Output (MDIO)
USB: 2× Universal Serial Bus (1.1 or 2.0) interfaces
GPIO: 36× General Purpose Input/Output ports
CAN: 2× Controller Area Network (CAN bus) 2.0b interfaces
High Speed Serial (HSS): 3× ports for T1/E1 or FXS/FXO connections
Serial: 1× Synchronous Serial Port (SSP)
Universal asynchronous receiver-transmitters (UARTs): 2× 16550 UART-compatible
SMB: 2× System Management Bus (SMBus) interfaces
LPC: 1× Low Pin Count (LPC 1.1) interface
SPI: 1× Serial Peripheral Interface Bus (SPI) boot interface
RTC: Integrated real-time clock (RTC) support
EDMA: Enhanced DMA (EDMA) engine with low latency memory transfers; supports multiple peer-to-peer configurations
Operating temperature: 0 to 70 degrees C (most models); −40 to 85 degrees C (some models)
List of Intel 80579 processors
All models support: MMX, Streaming SIMD Extensions (SSE), SSE2, SSE3, XD bit (an NX bit implementation)
Die size: 225 mm²
Steppings: B1
See also
References
External links
Ars Technica: Intel Confirms details of Tolapai, a SoC embedded processor
Intel QuickAssist Acceleration Technology for Embedded Systems