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Wikipedia / List of Intel Atom processors

Intel Atom is Intel's line of low-power, low-cost and low-performance x86 and x86-64 microprocessors. Atom, with codenames of Silverthorne and Diamondville, was first announced on March 2, 2008.

For nettop and netbook Atom microprocessors after Diamondville, the memory and graphics controller are moved from the northbridge to the CPU. This explains the drastically increased transistor count for post-Diamondville Atom microprocessors.

NettopNettop processors (small desktop)

Bonnell (microarchitecture)Bonnell microarchitecture

"Diamondville (microprocessor)Diamondville" (45 nm)

"Pineview (microprocessor)Pineview" (45 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Hyper-Threading

  • Integrated GMA 3150 GPU and DDR3/DDR2 single-channel memory controller

  • Transistors: 123 million (single-core), 176 million (dual-core)

  • Die size: 66mm2 (9.56 × 6.89) (single-core), 87mm2 (9.56 × 9.06) (dual core)

  • Package size: 22mm × 22mm

Saltwell microarchitecture

"Cedarview (microprocessor)Cedarview" (32 nm)

NetbookNetbook processors (sub-notebook)

Bonnell (microarchitecture)Bonnell microarchitecture

"Diamondville (microprocessor)Diamondville" (45 nm)

"Pineview (microprocessor)#Pineview microprocessorPineview" (45 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading

  • Integrated GMA 3150 GPU and DDR3/DDR2 single-channel memory controller supporting up to 2GB

  • Transistors: 123 million (single-core), 176 million (dual-core)

  • Die size: 66mm2 (9.56 × 6.89) (single-core), 87mm2 (9.56 × 9.06) (dual core)

  • Package size: 22mm × 22mm

Saltwell microarchitecture

"Cedarview (microprocessor)#Cedarview microprocessorCedarview" (32 nm)

List of Intel mobile Internet device platformsMID processors/SoCs (UMPCUMPC/SmartphoneSmartphone/Internet of thingsIoT)

Bonnell (microarchitecture)Bonnell microarchitecture

"Silverthorne (microprocessor)Silverthorne" (45 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation)

  • Models Z520, Z520PT, Z530, Z530P, Z540, Z550 and Z560 support Intel VT-x and Hyper-Threading

  • Model Z515 supports Intel Burst Performance Technology

  • Uses the Poulsbo chipset.

  • Transistors: 47 million

  • Die size: 26mm2

  • Package size: 13mm × 14mm / 22mm × 22mm (processors ending with the P or PT sSpec number)

"Lincroft (microprocessor)Lincroft" (45 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading. All except Z605 support Intel Burst Performance Technology (BPT).

  • GMA 600 GPU and DDR2 single-channel memory controller are integrated into the processor.

  • Transistors: 140 million

  • Die size: 7.34mm × 8.89mm = 65.2526mm2

  • Package size: 13.8mm × 13.8 × 1.0mm

  • Steppings: C0

Saltwell microarchitecture

"Penwell (SoC)Penwell" (32 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Intel Burst Performance Technology (BPT), Hyper-Threading.

  • Integrated PowerVR SGX540 GPU and DDR3 single-channel memory controller

  • Package size: 12mm × 12 × 1.0mm

  • Transistors: 140 million

  • Die size: 65.2526mm2 (7.34mm x 8.89mm)

SilvermontSilvermont microarchitecture

"SilvermontMerrifield" (22 nm)

"SilvermontMoorefield" (22 nm)

"Rockchip#Tablet processors with integrated modemSoFIA" (28 nm)

  • SoFIA (smart or feature phone with Intel architecture)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Burst Performance Technology (BPT), Intel VT-x, AES-NI (based on Silvermont's specs)

  • GPU (ARM Mali) and memory controller are integrated onto the processor die

  • Package size: 34 × 40mm

SoFIA 3G SoC with Silvermont CPU

  • Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio (Atom x3-C3130)

SoFIA 3G–R SoC with Silvermont CPU

  • Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio (Atom x3-C3230RK)

SoFIA LTE (W) with Airmont CPU (Announced, but never launched)

  • Integrated LTE Cat. 4 (XG726-based), SMARTi 4.5, LnP/ CG2000, PMIC (Atom x3-C3440 & C3445)

Tablet computer#Intel tablet platformsTablet processors/SoCs

Bonnell (microarchitecture)Bonnell microarchitecture

"Lincroft (microprocessor)Lincroft" (45 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading. All except Z605 support Intel Burst Performance Technology (BPT).

  • GMA 600 GPU and DDR2 single-channel memory controller are integrated onto the processor die

  • Transistors: 140 million

  • Die size: 7.34mm × 8.89mm = 65.2526mm2

  • Package size: 13.8mm × 13.8 × 1.0mm

  • Steppings: C0

Saltwell microarchitecture

"Cloverview (SoC)Cloverview" (32 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading, Intel Burst Performance Technology (BPT).

  • GPU and memory controller are integrated onto the processor die

  • Package size: 13.8mm × 13.8 × 1.0mm

  • Steppings:B1, C0

No official TDP available. For power data see page 129–130.

SilvermontSilvermont microarchitecture

"SilvermontBay Trail-T" (22 nm)

Type 4 SoC:

  • DDR3L single-channel or LPDDR3 dual-channel memory controller supporting up to 4GB; ECC supported in single-channel mode

  • Display controller with 2 MIPI DSI ports and 2 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4a)

  • Integrated Intel HD Graphics (Gen7) GPU

  • One USB 3.0 controller supporting one USB 3.0 port (can be multiplexed to support four USB 2.0 ports)

  • One USB 2.0 controller supporting four ports

  • Integrated LPE audio controller

  • Integrated image signal processor supporting two MIPI CSI ports, 24 MP sensors, and stereoscopic video

  • Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC

  • Serial I/O supporting SPI, UART (serial port), I2C or PWM

Type 3 SoC:

  • DDR3L/L-RS single-channel memory controller supporting up to 2GB

  • Display controller with 1 MIPI DSI port and 2 DDI ports (HDMI 1.4)

  • Integrated Intel HD Graphics (Gen7) GPU

  • One USB controller supporting two USB 2.0 ports

  • Integrated LPE audio controller

  • Integrated image signal processor supporting two MIPI CSI ports and 8 MP sensors

  • Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC

  • Serial I/O supporting SPI, UART (serial port), I2C or PWM

SilvermontAirmont microarchitecture

"SilvermontCherry Trail-T" (14 nm)

Type 4 SoC:

  • LPDDR3 dual-channel memory controller supporting up to 8GB

  • PCI Express 2.0 controller with 2 lanes

  • Display controller with 2 MIPI DSI ports and 3 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4b)

  • Integrated Intel HD Graphics (Gen8) GPU

  • One USB xHCI controller supporting three USB 3.0 ports, two SSCI ports, and two HSIC ports

  • One USB xDCI controller supporting one USB 3.0 port

  • Integrated LPE audio controller

  • Integrated image signal processor supporting three MIPI CSI ports and 13 MP ZLS sensors

  • Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC

  • Serial I/O supporting SPI, UART (serial port), I2C or PWM

Type 3 SoC:

  • DDR3L/L-RS single-channel memory controller supporting up to 2GB

  • PCI Express 2.0 controller with 1 lane

  • Display controller with 2 MIPI DSI ports and 2 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4b)

  • Integrated Intel HD Graphics (Gen8) GPU

  • One USB controller supporting three USB 2.0 ports and two HSIC ports

  • Integrated LPE audio controller

  • Integrated image signal processor supporting three MIPI CSI ports and 8 MP sensors

  • Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC

  • Serial I/O supporting SPI, UART (serial port), I2C or PWM

Embedded systemEmbedded processors/System on a chipSoCss

Bonnell (microarchitecture)Bonnell microarchitecture

"Tunnel Creek (microprocessor)Tunnel Creek" (45 nm)

  • CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), hyper-threading, Intel VT-x.

  • Package size: 22mm × 22mm

  • Steppings: B0

  • Temperature range: for (E620, E640, E660, E680): 0°C to +70°C, for (E620T, E640T, E660T, E680T): -40°C to +85°C.

  • DDR2 single-channel memory controller supporting up to 2GB

  • PCI Express 1.0a controller with 4 lanes

  • Display controller with LVDS and serial DVO ports

  • Integrated GMA600 (PowerVR) GPU

  • Integrated HD audio controller

  • Serial I/O supporting SPI

"Stellarton (microprocessor)Stellarton" (45 nm)

  • "Tunnel Creek" CPU with an Altera Field Programmable Gate Array (FPGA)

  • CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Hyper-Threading, Intel VT-x

  • Package size: 37.5mm × 37.5mm

  • Steppings: B0

  • TDP without FPGA. Total package TDP depends on functions included in FPGA. Max. TDP 7 W.

  • Temperature range: for (E625C, E645C, E665C): 0°C to +70°C, for (E625CT, E645CT, E665CT): -40°C to +85°C.

  • DDR2 single-channel memory controller supporting up to 2GB

  • PCI Express 1.0a controller with 4 lanes

  • Display controller with LVDS and serial DVO ports

  • Integrated GMA600 (PowerVR) GPU

  • Integrated HD audio controller

  • Serial I/O supporting SPI

SilvermontSilvermont microarchitecture

"SilvermontBay Trail-I" (22 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, TXT/TXE

  • Package size: 25mm × 27mm

  • DDR3L dual-channel memory controller supporting up to 4GB; ECC supported in single-channel mode

  • Display controller with 2 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4a)

  • Integrated Intel HD Graphics (Gen7) GPU

  • PCI Express 2.0 controller with four lanes and four root ports

  • Two SATA-300 ports

  • One USB 3.0 controller supporting one USB 3.0 port (can be multiplexed to support four USB 2.0 ports)

  • One USB 2.0 controller supporting four ports

  • Integrated LPE and HD audio controllers

  • Integrated image signal processor supporting three MIPI CSI ports, 24 MP sensors, and stereoscopic video

  • Integrated memory card reader supporting SDIO 3.0, eMMC 4.5, and SDXC

  • Serial I/O supporting SPI, UART (serial port), I2C or PWM

SilvermontAirmont microarchitecture

"SilvermontBraswell" (14 nm)

GoldmontGoldmont microarchitecture

"GoldmontApollo Lake" (14 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, TXT/TXE

  • Package size: 24mm × 31mm

  • DDR3L/LPDDR3/LPDDR4 dual-channel memory controller supporting up to 8GB; support for DDR3L with ECC

  • Display controller with 1 MIPI DSI port and 2 DDI ports (eDP 1.3, DP 1.1a, or HDMI 1.4b)

  • Integrated Intel HD Graphics (Gen9) GPU

  • PCI Express 2.0 controller supporting 6 lanes (3 dedicated and 3 multiplexed with USB 3.0); 4 lanes available externally

  • Two USB 3.0 ports (1 dual role, 1 dedicated, 3 multiplexed with PCI Express 2.0 and 1 multiplexed with one SATA-300 port)

  • Two USB 2.0 ports

  • Two SATA-600 ports (one multiplexed with USB 3.0)

  • Integrated HD audio controller

  • Integrated image signal processor supporting four MIPI CSI ports and 13 MP sensors

  • Integrated memory card reader supporting SDIO 3.01 and eMMC 5.0

  • Serial I/O supporting SPI, HSUART (serial port) and I2C

Tremont (microarchitecture)Tremont microarchitecture

"Tremont (microarchitecture)Elkhart Lake" (10 nm)

Gracemont (microarchitecture)Gracemont microarchitecture

"Amston Lake" (7 nm)

In Q2 2024 Intel launched these cpus: Atom® x7203C, Atom® x7211RE, Atom® x7213RE, Atom® x7405C, Atom® x7433RE, Atom® x7809C, Atom® x7835RE. These processors have 2-8 cpu cores and use 6-25 watts of power.

Server (computing)Server SoCs

All Atom server processors include ECC support.

Bonnell (microarchitecture)Saltwell microarchitecture

"Centerton (SoC)Centerton" (32 nm)

"Briarwood (SoC)Briarwood" (32 nm)

SilvermontSilvermont microarchitecture

"SilvermontAvoton" (22 nm)

"SilvermontRangeley" (22 nm)

GoldmontGoldmont microarchitecture

"GoldmontDenverton" (14 nm)

Tremont (microarchitecture)Tremont microarchitecture

"Tremont (microarchitecture)Snow Ridge" (10 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, ECC memory.

  • Same frequency for all models: 2.2GHz. L2 cache: 4.5MB per module; each module comprises four CPU cores.

  • SoC peripherals include 4 × USB 3.0, 4 × USB 2.0, 16 × SATA, Integrated Intel Ethernet 800 series 100Gbit/s LAN, 3 × UART, and up to 32 lanes of PCI Express (16 × 2.0, 16 × 3.0), in x16, x8, and x4 configurations.

  • Intel Dynamic Load Balancer (Intel DLB) & Intel QuickAssist Technology (Intel QAT)

  • P####B models are designed for base transceiver stations, especially that for 5G networks. All other models are designed for communications (extended temperature range).

  • Package size: 47.5mm × 47.5mm

"Tremont (microarchitecture)Parker Ridge" (10 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, ECC memory.

  • SoC peripherals include 4 × USB 3.0, 4 × USB 2.0, 16 × SATA, Integrated Intel Ethernet 800 series 100Gbit/s LAN (except 51xx model numbers), 3 × UART, and up to 32 lanes of PCI Express (16 × 2.0, 16 × 3.0), in x16, x8, and x4 configurations.

  • Intel Dynamic Load Balancer (Intel DLB) & Intel QuickAssist Technology (Intel QAT)

  • Model numbers ending in 0 are extended temperature range; model numbers ending in 5 are commercial temperature range.

  • Package size: 47.5mm × 47.5mm

Intel Consumer ElectronicsCE SoCs

Single-core CE SoCs

"Sodaville (SoC)Sodaville" (45 nm)

  • Package size: 27mm × 27mm

  • GPU (based on the PowerVR SGX535 from Imagination Technologies)

"Groveland (SoC)Groveland" (45 nm)

CE4200

  • Package size: ??mm × ??mm

  • 2 × 32-bit memory channels, up to DDR2-800

  • GPU (based on the PowerVR SGX535 from Imagination Technologies)

Dual-Core CE SoCs

"Berryville (SoC)Berryville" (32 nm)

  • Package size: ??mm × ??mm

  • GPU for 3D (based on the PowerVR SGX545 from Imagination Technologies)

  • GPU for 2D (GC300 from Vivante)

See also

References